使用法
BGA chip-level repairing, IC soldering reballing
Temperature zone
3 zones top, bottom and preheating
Bottom heater
2nd heater 800W, 3rd IR heater 2200W
Positioning
V-groove, with external universal fixture
Temperature control Settings
8 levels of variable (up/down) and constant temperature controls
Temperature curves
N groups storage
PCB size
Min. 10mm*10mm Max. 350mm*400mm
Infrared Preheating area
210mm*340mm