その他の名前
Thermal Conductive Potting Compound
タイプ
Thermal Conductive Glue
Main Material
Vinyl polysiloxane
Application
Electrical insulating,LED potting,Automotive,Battery,Pv junction box
Feature
Higt thermal conductivity,Insulation
Advantage
Non-toxic,High-temperature resistance,Chemical resistance
Curing time
2min(100℃),15~30min(80℃)
Curing system
Room Temperature/Heat Curing Addition Molded Silicone Materials