主要な原料
liquid silicone rubber
使用法
encapsulation of general electronic components and circuit board
その他の名前
Electronic potting adhesive
Component a appearance
Transparent fluid
Viscosity of component a MPa. S / 25 ℃
1250±250
Use ratio a: B (weight ratio)
100:10
Operating time min / 25 ℃
30-60
Complete curing time h / 25 ℃
24
Shear strength (for aluminum) MPa
0.6
Dielectric loss tangent (1MHz)
3x10-3
Dielectric constant (1MHz)
3.2
Breakdown strength kV / mm
16